Accelerating the Future of 3D Microsystems

TIE is a pure-play foundry redefining what’s possible in microsystem innovation. Our advanced mixed-material interconnect technology and standardized EDA flows unlock up to 100x improvements in microsystem performance. We help you move from idea to impact faster.*

*Based on DARPA’s anticipated improvement in multi-material 3DHI microsystem performance over standard 2D silicon microsystems.

$1.45B+ in Funding to Advance America’s Semiconductor Future

TIE is building the nation’s first pure-play 3D microsystems integration foundry, powered by $1.45B in combined investment from the U.S. Department of War and the State of Texas.

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Introducing America’s Semiconductor Training Center

TIE’s new 25,000+ sq. ft. facility is training the next-generation of talent in advanced semiconductor manufacturing and analytics, with a focus on 3DHI.

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Leading the Next Wave of Semiconductor Innovation

Texas is primed to lead semiconductor innovation—powered by world-class fabs, talent, and TIE’s push for advanced microsystem and interconnect infrastructure.

Technology Leadership

Accelerating 3DHI with advanced interconnects — hybrid bonding, multi-material integration, and next-gen thermal and materials solutions for faster time-to-market and higher yields.

Critical Fab Assets

Scaling an industrial-scale fab with advanced assembly and bonding tools to accelerate the shift from prototype to high-volume production and strengthen U.S. semiconductor leadership.

Workforce Development

Building a dynamic skilled semiconductor workforce — from technicians to PhDs — through hands-on experience, training programs, and clear career paths.

Defense/Startup Ecosystem

Driving breakthroughs in AI, quantum, healthcare, telecom, and defense with a pure-play foundry model that accelerates innovation and scale.

Industry Support for State of Texas Funding

“TIE’s vision, plans and achievements to-date have convinced us as corporate leaders in the semiconductor industry to join this effort and partner with TIE to provide technology leadership, build critical research and manufacturing infrastructure, and establish workforce development efforts that are essential to strategic long-term success for both the commercial and defense sectors of the US semiconductor industry.”